Sep 30 - Oct 2, 2026

Hyatt Regency, Greenville SC

The premier open forum for Automotive Packaging Professionals

Get the latest on the 2026 event

Sept 30 - Oct 2, 2026 • Hyatt Regency, Greenville SC

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Todd Chesna, Ford

2025 APS Keynote Speaker Todd Chesna, Manager – Packaging Engineering at Ford, shares strategies for integrating and optimizing packaging in new vehicle programs.

Featuring Subject-Matter Experts From:

BMW

BMW

BMW

An average production automobile has 30,000 parts and tens of thousands of associated packages throughout the vehicle’s life cycle.

All the right folks, gathered in ONE room

At the Automotive Packaging Summit, we explore the specific packaging and logistics challenges faced by OEMs and Tier1 Part Suppliers, and their impact on Transportation and Logistics. Industry veterans and Packaging Experts specializing in Automotive Packaging Solutions share insights to streamline this process through knowledge sharing.

2025 Highlights

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Subject-Matter Experts

Thank You to our industry veterans for their contributions to the Automotive Packaging Summit.

Dan Belbey

BMW

Todd Chesna

Ford Motor Company

Connor DeYoung

Mazda

Jeremy Galanty

General Motors

Andrew Hurley

Clemson University

Kelsey Kester

BMW

Nathan Kilcoyne

Nissan North America

Joseph McCabe

AFS

Nasser Nasser

General Motors

Vidya Seeram

Volvo

Alex Seger

Nissan North America

Dan Universal

Isuzu North American Corporation

Thank You To Our 2026 Sponsors

With their commitment to the industry, our sponsors and the Packaging School continue to amplify the event experience and the industry it serves.

Get Involved. Become a Sponsor.

Our Title Sponsor

TriEnda is a U.S. based global manufacturer of thermoformed packaging and material handling solutions. With a heritage of over 40 years of industry expertise, excellent custom designs, and experienced teams, TriEnda leads the thermoforming industry in innovation and service.

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