Sep 30 - Oct 2, 2026

Hyatt Regency, Greenville SC

The premier open forum for Automotive Packaging Professionals

Get the latest on the 2026 event

Sept 30 - Oct 2, 2026 • Hyatt Regency, Greenville SC

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Todd Chesna, Ford

2025 APS Keynote Speaker Todd Chesna, Manager – Packaging Engineering at Ford, shares strategies for integrating and optimizing packaging in new vehicle programs.

Featuring Subject-Matter Experts From:

BMW

BMW

BMW

An average production automobile has 30,000 parts and tens of thousands of associated packages throughout the vehicle’s life cycle.

All the right folks, gathered in ONE room

At the Automotive Packaging Summit, we explore the specific packaging and logistics challenges faced by OEMs and Tier1 Part Suppliers, and their impact on Transportation and Logistics. Industry veterans and Packaging Experts specializing in Automotive Packaging Solutions share insights to streamline this process through knowledge sharing.

2025 Highlights

What Makes APS Unique?

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Subject-Matter Experts

Thank You to our industry veterans for their contributions to the Automotive Packaging Summit.

Dr. Andrew Hurley

Packaging School

Nate Franck

TriEnda

Stephanie Aiello

Goodpack USA Inc.

Michael Schwabe

Surgere

Mike Pagel

HazMat Safety Consulting

Dan Belbey

BMW

Dan Casillo

Ventek

Chris Roush

Honda NA

Bridget Grewal

Magna

Matthew Baron

Isuzu Logistics North America, Inc, (ILNA)

Ben Hesskamp

Guardian Container Consulting

Jeremy Galanty

Vidya

Volvo Group NA

Jose Parra

BMW

Sam Moorhead

Bosch USA

James Sternberg

Clemson University

Jonathan Brekan, Ph.D.

Daubert Cromwell

Blake Watkins

Bosch

Thomas Strain

Surgere

Todd Chesna

Ford Motor Company

Keesha Jones

General Motors

Rick Potter

RESRG Automotive

Chris Boyd

Lucid

Aravind Chintalapati

Tesla Inc.

Lucas Hesskamp

Guardian Container Consulting

Chris Elias

ARMOR Protective Packaging

Xavier Ovize

KTPconTeyor

Thank You To Our 2025 Sponsors

With their commitment to the industry, our sponsors and the Packaging School continue to amplify the event experience and the industry it serves.

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Our Title Sponsor

TriEnda is a U.S. based global manufacturer of thermoformed packaging and material handling solutions. With a heritage of over 40 years of industry expertise, excellent custom designs, and experienced teams, TriEnda leads the thermoforming industry in innovation and service.

Exhibitors

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